Hamburglobal Funding Program
Hamburglobal: financial support for students who would like to go abroad during their studies
The Hamburglobal funding program supports University of Hamburg students who would like to go abroad during their studies by providing monthly subsidies of €350 to €550 to cover living expenses (country-dependent, max. 3 months; 6 months for two-semester stays; monthly subsidy rates 2025; rates 2026). Funding is available for study abroad, internships, language courses, technical/specialist courses, and for students who want to prepare their final thesis abroad.
Study abroad and internships in Europe or in the Erasmus countries (EU member states as well as Iceland, Liechtenstein, Macedonia, Norway, Serbia and Turkey) are generally not eligible for funding. See the Erasmus Program website for information about studying and doing internships in Europe.
Funding for Hamburglobal comes from the German Academic Exchange Service (DAAD) PROMOS funds (Programm zur Steigerung der Mobilität von deutschen Studierenden—program to increase the mobility of German students) and University of Hamburg. In addition, the Steffens Memorial Fund may award foundation funds.
Funding periods
Current application deadlines:
- 1–31 March 2025 for stays abroad that will begin between 1 July and 31 December 2025.
- 1–31 October 2025 for stays abroad that will begin between 1 January and 30 June 2026.
Submit your application exclusively online by the specified deadline. The online application portal is available from 1–31 March and from 1-31 October respectively. Applications are accepted during these periods only. Follow the guidelines for online applications.
We recommend that you observe the above-mentioned application deadlines to ensure planning security early on. For stays abroad planned at short notice, you have the following application possibility:
- 1–31 March 2025:
- for stays abroad that will begin between 1 April and 30 June 2024.
This option does not apply to applications that were rejected in the previous application round.

